Intel and Siemens Communications are gearing up to showcase the fruits of a joint second generation VoIP project.
The chip and communications giants have paired up to fund research into real-time open unified communications and secure wireless networks, in addition to creating sector-specific offerings.
The two hope to showcase initial results, which will include video and voice conference and mobile client capabilities, by the end of this year. The ultimate aim being to demonstrate the technology using Intel architecture such as Intel dual-core technology and rack mounted servers and Siemens' HiPath 8000 and OpenScape platforms.
In working together, Intel and Siemens hope to help organisations, specifically in the telecommunications, healthcare and financial services sectors, optimise business processes.
"As a result of this collaboration, enterprise customers will be able to avail themselves of unified communications based on the industry's highest performance and most cost effective architecture," said Gordon Graylish, Intel's vice president of sales and marketing and general manager of Europe, the Middle-East and Africa (EMEA).
Intel also plans to use its lab facilities as a test bed for third parties to ensure their products are optimised to work with the new VoIP technologies.
